IC Appearance Inspection Service
Supports BGA packages, including QFP and TSOP, ensuring lead quality equivalent to that of semiconductor manufacturers at the time of shipment.
At Tsunetaka Technica, we offer "IC Appearance Inspection Services." Inspections are conducted through automatic measurement judgment using digital measurement and statistical processing. We inspect with an accuracy of 10 micrometers based on the dimensional drawings of semiconductor manufacturers, and we can detect foreign objects as small as approximately 20 micrometers in width. 【Features】 ■ Capable of detecting foreign objects between leads ■ Capable of inspecting foreign objects on surfaces ■ Responds to various needs such as lot sorting *For more details, please refer to the PDF materials or feel free to contact us.
- Company：通菱テクニカ株式会社（三菱電機グループ）
- Price：Other
